Amplifier devices with in-package transmission line combiner
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United States of America Patent
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Apr 11, 2017
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N/A
app pub date -
Dec 11, 2015
filing date -
Dec 11, 2015
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Abstract
The embodiments described herein include amplifiers that are typically used in radio frequency (RF) applications. The amplifiers described herein use a combiner that is implemented inside the device package. Specifically, the amplifiers can be implemented with a combiner that includes a transmission line inside the device package, where the transmission line has a length between first and second ends configured to provide an impedance inverter between the outputs (e.g., drain terminals) of transistors in the amplifier.
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