Method for fabricating miniature structures or devices such as RF and microwave components
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United States of America Patent
Stats
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Apr 11, 2017
Grant Date -
Jul 17, 2014
app pub date -
Feb 28, 2014
filing date -
Dec 3, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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International Classification(s)
- 2014 Application Filing Year
- C25D Class
- 592 Applications Filed
- 449 Patents Issued To-Date
- 75.85 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C25D Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 11, 2028 |
