Coating packaged chamber parts for semiconductor plasma apparatus

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United States of America Patent

PATENT NO 9617633
SERIAL NO

14066584

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Abstract

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An advanced coating for parts used in plasma processing chamber. The advanced coating is formed over an anodized surface that has not been sealed. After the coating is formed, the coated area is masked, and the remaining anodized surface is sealed. The porous and rough structure of the anodized but un-sealed aluminum enhances adhesion of the coating. However, to prevent particle generation, the exposed anodized surface is sealed after formation of the coating. The coating can be of yttria, formed by plasma enhanced atomic deposition techniques which results in a dense and smooth coating.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED MICRO-FABRICATION EQUIPMENT INC CHINA188 TAIHUA ROAD JINQIAO EXPORT PROCESSING ZONE (SOUTH AREA) PUDONG NEW AREA SHANGHAI 201201 201201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
He, Xiaoming Shanghai, CN 48 2380
Wan, Lei Shanghai, CN 188 2930
Xu, Zhaoyang Shanghai, CN 20 549
Yang, Ping Shanghai, CN 152 2194
Zhang, Hanting Shanghai, CN 4 295

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