Semiconductor device
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United States of America Patent
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Apr 11, 2017
Grant Date -
Jun 18, 2015
app pub date -
Dec 30, 2014
filing date -
Dec 13, 2013
priority date (Note) -
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Abstract
A method of forming a semiconductor device comprises bonding a capping wafer and a base wafer to form a wafer package. The base wafer comprises a plurality of chip package portions. The capping wafer comprises a plurality of isolation trenches. Each isolation trench of the plurality of isolation trenches is configured to substantially align with a corresponding chip package portion of the plurality of chip package portions. The method also comprises separating the wafer package into a plurality of chip packages. Each chip package of the plurality of chip packages comprises at least one chip package portion of the plurality of chip package portions.
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