Method of fabricating a composite engineered wood material floor board
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United States of America Patent
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Apr 11, 2017
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N/A
app pub date -
May 13, 2014
filing date -
Nov 5, 2008
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Abstract
The described method of fabricating a composite engineered wood material floor board, having a top wood layer secured to a wood material substrate layer, minimizes the effect of telegraphy in the resulting floor board. The method includes selecting a top wood layer from a top surface quality wood material having a thickness of between 1 mm and 8 mm, and selecting a substrate wood material layer having a minimum thickness of 6 mm and a thickness ratio between 1:1 and 1:10 between the top wood layer and the substrate wood material layer. A plurality of transverse rectangular spaced-apart grooves are also formed in a bottom surface of said wood substrate layer. The ratio between the depth of said grooves and the thickness of the substrate wood material has an impact on telegraphy of said grooves in said top wood layer and is therefore selected accordingly.
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