Apparatus and method for producing wafer blocks
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United States of America Patent
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Apr 11, 2017
Grant Date -
Apr 3, 2014
app pub date -
May 8, 2012
filing date -
May 11, 2011
priority date (Note) -
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Abstract
An apparatus and a method produce multi-layered wafer blocks which are filled with a spreading substance such as a cream, for example, in which a first wafer block component is transported along a conveying surface to a stacking area, is lifted there from the conveying surface by a gripping device, a second wafer block component is subsequently or simultaneously transported along the conveying surface to the stacking area, and the first wafer block component is placed and/or pressed onto the second wafer block component from above in a joining process.
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