Method for producing a high-aspect ratio conductive pattern on a substrate
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United States of America Patent
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Apr 4, 2017
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N/A
app pub date -
Sep 19, 2007
filing date -
Sep 22, 2006
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Abstract
Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
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