Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument
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United States of America Patent
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Apr 4, 2017
Grant Date -
Jan 23, 2014
app pub date -
Jul 15, 2013
filing date -
Jul 17, 2012
priority date (Note) -
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Abstract
For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.
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