Copper particulate dispersion, conductive film forming method and circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 4, 2017
Grant Date -
Dec 18, 2014
app pub date -
Jan 4, 2012
filing date -
Nov 14, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully