Silver filled trench substrate for high power and/or high temperature electronics
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United States of America Patent
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Apr 4, 2017
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N/A
app pub date -
May 10, 2013
filing date -
May 10, 2012
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Abstract
A power substrate utilizing silver conductors on ceramic, and the process for making said device. The insulating portion of the substrate is fabricated from a ceramic by placing trenches into the ceramic which can be filled with silver conductors. These conductors can serve the purpose of traces for electrical interconnection, pads for die attachment, as well as thermal conductors for heat pipes and heat spreaders. The conductors can be made on both the top and the bottom of the ceramic. Such substrates may be used for a multitude of applications requiring power substrates for conducting large currents, and are suitable for high efficiency, high temperature, and/or high reliability applications.
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