Substrate having annealed aluminum nitride layer formed thereon and method for manufacturing the same

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United States of America Patent

PATENT NO 9614124
SERIAL NO

14634713

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Abstract

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A substrate having an annealed AlN layer includes a substrate made of a material selected from among a group including sapphire, silicon carbide (SiC), and aluminum nitride (AlN), and an aluminum nitride (AlN) layer formed on the substrate and having a thickness of 100 nm or greater. The aluminum nitride layer is annealed at a prescribed annealing temperature and in a nitrogen/carbon monoxide (N2/CO) mixed gas atmosphere, and the nitrogen/carbon monoxide (N2/CO) mixed gas has a mixture ratio of N2 gas/CO gas in a range of 0.95/0.05 to 0.4/0.6.

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Patent Owner(s)

Patent OwnerAddress
TOHOKU UNIVERSITY2-1-1 KATAHIRA AOBA-KU SENDAI-SHI MIYAGI-PREFECTURE 980-8577
MIE UNIVERSITYTSU-SHI MIE 514-8507

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuyama, Hiroyuki Sendai, JP 42 371
Miyake, Hideto Tsu, JP 19 250

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