Method of forming electromagnetic interference shielding layer of ball grid array semiconductor package and base tape for the method
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United States of America Patent
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Apr 4, 2017
Grant Date -
Nov 24, 2016
app pub date -
May 16, 2016
filing date -
May 19, 2015
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Abstract
Provided are a method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package, and a base tape used in the method, and more particularly, a method of forming a shielding layer for blocking EMI, on an upper surface and lateral surfaces of a BGA semiconductor package having a lower surface, on which a plurality of solder balls are formed, and a base tape used in the method.
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