Electronic packages for flip chip devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9613891
APP PUB NO 20160247748A1
SERIAL NO

14968688

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Abstract

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Electronic packages are formed from a generally planar leadframe having a plurality of leads coupled to a GaN-based semiconductor device, and are encased in an encapsulant. The plurality of leads are interdigitated and are at different voltage potentials.

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Patent Owner(s)

Patent OwnerAddress
NAVITAS SEMICONDUCTOR LIMITED22 FITZWILLIAM SQUARE SOUTH SAINT PETER'S DUBLIN D02 FH68

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kinzer, Daniel M El Segundo, US 142 3679

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