Semiconductor device having improved heat-dissipation characteristics

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United States of America Patent

PATENT NO 9613881
APP PUB NO 20160086869A1
SERIAL NO

14891629

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A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.

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Patent Owner(s)

Patent OwnerAddress
SK HYNIX INCBUBAL-EUB ICHEON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Heui Gyun Gyeonggi-do, KR 14 51
Ahn, Sang Wook Gyeonggi-do, KR 13 260
Jun, Sung Chun Gyeonggi-do, KR 4 41
Jung, Huy Chan Gyeonggi-do, KR 8 248
Lee, Yong Woon Gyeonggi-do, KR 14 266

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