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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
CITIBANK N A	388 GREENWICH STREET NEW YORK NY 10013

International Classification(s)

• C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chen, Qingyun	Branford, US	39	269
Hurtubise, Richard	Clinton, US	35	310
Lin, Xuan	Watervliet, US	36	416
Paneccasio,, Jr Vincent	Madison, US	25	150

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 4, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 04, 2017	US,9613858,B2   US9613858B2	GRANTED PATENT AS SECOND PUBLICATION
October 30, 2014	US,20140322912,A1   US20140322912A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9613858

Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers

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