Positive temperature coefficient circuit protection chip device
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United States of America Patent
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Apr 4, 2017
Grant Date -
Mar 30, 2017
app pub date -
Sep 30, 2015
filing date -
Sep 30, 2015
priority date (Note) -
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Abstract
A method of making a PTC protection chip device includes: preparing an assembly of a PTC polymer material, a spacer unit, and first and second electrode sheets of a metal-plated copper foil, the PTC polymer material and the spacer unit of the assembly being sandwiched between and cooperating with the first and second electrode sheets to form a stack; subjecting the stack to a hot pressing process, so that the first and second electrode sheets contact and are pressed against the PTC polymer material and the spacer unit and so that the PTC polymer material is bonded to and cooperates with the first and second electrode sheets to form a PTC laminate; and cutting the PTC laminate so as to form the PTC circuit protection chip device.
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