Etching amount measurement apparatus for dry etching apparatus

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United States of America Patent

PATENT NO 9612205
SERIAL NO

14463947

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Abstract

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According to one embodiment, an etching amount measurement pattern is provided in a surface of a substrate. The pattern comprises a plurality of components two-dimensionally disposed and causing light incident on the pattern to be diffracted,

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Patent Owner(s)

Patent OwnerAddress
SHIBAURA MECHATRONICS CORPORATION5-1 KASAMA 2-CHOME SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-8610

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IvanPetrov, Ganachev Kanagawa, JP 1 0
Iwami, Munenori Kanagawa, JP 7 160

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