Sulfonamide based polymers for copper electroplating

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United States of America Patent

PATENT NO 9611560
APP PUB NO 20160186345A1
SERIAL NO

14585227

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Abstract

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Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONIC MATERIALS INTERNATIONAL LLC455 FOREST STREET MARLBOROUGH MA 01752

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Weijing New Territories, HK 10 3
Niazimbetova, Zuhra I Westborough, US 21 29
Rzeznik, Maria Anna Shrewsbury, US 44 277

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