Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
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United States of America Patent
Stats
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Apr 4, 2017
Grant Date -
Jun 30, 2016
app pub date -
Apr 7, 2015
filing date -
Dec 29, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.
First Claim
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International Classification(s)
- 2015 Application Filing Year
- C08J Class
- 2246 Applications Filed
- 1523 Patents Issued To-Date
- 67.81 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C08J Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 4, 2028 |
