Highly crosslinked polymer dielectric films for improved capacitor performance
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 4, 2017
Issued Date -
N/A
app pub date -
May 30, 2014
filing date -
Jun 6, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully