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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HAKKO CORPORATION	4-5 SHIOKUSA 2-CHOME NANIWA-KU OSAKA CITY OSAKA 556-0024

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Mochizuki, Toshikazu	Osaka, JP	22	217
Takeuchi, Hitoshi	Osaka, JP	98	1015
Yokoyama, Tetsuo	Osaka, JP	69	936

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 4, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 04, 2017	US,9610645,B2   US9610645B2	GRANTED PATENT AS SECOND PUBLICATION
June 23, 2016	US,20160175959,A1   US20160175959A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9610645

Desoldering tool and control system

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