Encapsulant materials and a method of making thereof
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United States of America Patent
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Mar 28, 2017
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app pub date -
Apr 5, 2013
filing date -
Apr 5, 2012
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Abstract
The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
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