Sequential wafer bonding
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United States of America Patent
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Mar 28, 2017
Issued Date -
N/A
app pub date -
Jul 20, 2015
filing date -
Aug 27, 2013
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Abstract
Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.
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