Apparatus for mounting semiconductor chips
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United States of America Patent
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Mar 21, 2017
Grant Date -
May 30, 2013
app pub date -
Sep 13, 2012
filing date -
Nov 25, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.
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