Method and products related to deposited particles
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United States of America Patent
Stats
-
Mar 21, 2017
Grant Date -
Nov 1, 2012
app pub date -
Nov 15, 2010
filing date -
Nov 13, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.
First Claim
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International Classification(s)
- 2010 Application Filing Year
- B82Y Class
- 1402 Applications Filed
- 567 Patents Issued To-Date
- 40.45 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B82Y Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 21, 2028 |
