Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 21, 2017
Issued Date -
N/A
app pub date -
Mar 26, 2015
filing date -
Mar 28, 2014
priority date (Note) -
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Abstract
A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.
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