Substrate holding device, semiconductor fabrication device, and substrate clamping ascertainment method
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United States of America Patent
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Mar 21, 2017
Grant Date -
Jun 11, 2015
app pub date -
Jul 17, 2014
filing date -
Dec 11, 2013
priority date (Note) -
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Abstract
A substrate holding device is provided with an electrostatic chuck that has an electrode therein and is provided with a substrate holding surface, on one side of which a substrate is held; a displacement gauge that is disposed above or below the substrate holding surface; and a controller which, along with using the displacement gauge to measure a first distance to the substrate when a substrate is placed on the substrate holding surface, uses the displacement gauge to measure a second distance to the substrate after a predetermined voltage is applied to the electrode of the electrostatic chuck and, based on the difference between the measured distances, ascertains whether the clamping of the substrate to the electrostatic chuck has been performed in a normal manner.
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