Mold for impregnating a prefabricated condenser core of a high-voltage bushing and device for forming a condenser core of a high-voltage bushing
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United States of America Patent
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Mar 21, 2017
Grant Date -
Sep 18, 2014
app pub date -
Mar 13, 2014
filing date -
Mar 14, 2013
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Abstract
An exemplary mold is disclosed for impregnating a prefabricated condenser core (C) of a high voltage bushing with a liquid resin and includes two mold modules movable against each other and shaped to form an axially symmetric mold cavity. The mold forms a column of cylindrical design, in which the at least two mold modules are arranged on top of each other. A first of the two mold modules can be executed as a hollow cylinder. Two opposing front faces of the two mold modules and a circular O-ring arranged between the two opposing front faces form a first sealing interface of the metal mold. Such a mold can have a very efficient sealing system and allow high pressures to be applied to the liquid resin and a beneficial forming of the condenser core in a device in which the resin is cured according to a specified temperature profile.
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