Photosintering of micron-sized copper particles
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United States of America Patent
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Mar 21, 2017
Grant Date -
May 28, 2015
app pub date -
Jul 9, 2013
filing date -
Jul 9, 2012
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Abstract
Micron-sized metal particles in an ink or paste composition are deposited onto a substrate and then photosimered. The substrate may comprise a polymeric material. The polymeric substrate may have a coefficient of thermal expansion greater than two times the coefficient of thermal expansion of the photosimered ink or paste composition.
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