Resin for blister package and preparation method thereof
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United States of America Patent
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Mar 21, 2017
Grant Date -
Dec 17, 2015
app pub date -
Dec 17, 2013
filing date -
Jan 8, 2013
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Abstract
The present invention relates to a resin for a blister package and a preparation method thereof. The resin for a blister package according to the present invention is a water-soluble resin which can minimize a hazard to a human body due to residual of a solvent, and particularly, a resin layer formed by using the resin can show an excellent heat seal property and is hardly deformed at the heat seal temperature condition.
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