Packaging having a surrounding heat barrier
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United States of America Patent
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Mar 21, 2017
Grant Date -
May 1, 2014
app pub date -
Apr 23, 2012
filing date -
Apr 21, 2011
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Abstract
In an insulating element (1) for bounding spaces to be thermally insulated, e.g. for transport or packaging containers, comprising an in particular plate-shaped substrate element (2) made of a material having a low thermal conductivity, such as a polymer, the substrate element (2) is provided with a metallic coating (3) having a low emissivity in order to reduce the thermal radiation, yet is applied in a layer thickness of <80 nm, preferably <50 nm, such that the thermal conduction of the metallic coating will only insignificantly reduce the thus optimized insulating value. The metallic coating in the nanometer range does not only reduce the thermal radiation, but also enables optimal gas tightness with minimal thermal conduction.
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