Electrochemical fabrication method including elastic joining of structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 21, 2017
Grant Date -
Aug 28, 2014
app pub date -
Feb 28, 2014
filing date -
May 7, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2014 Application Filing Year
- C25D Class
- 592 Applications Filed
- 449 Patents Issued To-Date
- 75.85 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- C25D Class
- 36.72 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 21, 2028 |
