Semiconductor device including electromagnetic absorption and shielding
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United States of America Patent
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Mar 14, 2017
Grant Date -
Aug 21, 2014
app pub date -
Apr 26, 2012
filing date -
Apr 26, 2012
priority date (Note) -
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Abstract
A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (202), one or more semiconductor die (224,225), and molding compound around the one or more semiconductor die (224,225). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer (210) on the substrate (202). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.
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