Heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers
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United States of America Patent
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Mar 14, 2017
Grant Date -
Oct 13, 2016
app pub date -
May 29, 2015
filing date -
Apr 13, 2015
priority date (Note) -
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Abstract
A heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers is disclosed to include a radiation fin set, a heat-dissipation spacer placed on the radiation fin set and defining opposing first surface and second surface, a first heat dissipation layer including multiple first heat pipes with respective first segments thereof placed on the first surface of the heat-dissipation spacer, and a second heat dissipation layer including multiple second heat pipes with respective first segments thereof placed on the second surface of the heat-dissipation spacer. At least a part of the first segment of at least one first heat pipe of the first heat dissipation layer is disposed overlapped on at least a part of the first segment of at least one second heat pipe of the second heat dissipation layer in a parallel manner.
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