Resin composition for encapsulating optical element
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United States of America Patent
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Mar 14, 2017
Grant Date -
Dec 31, 2015
app pub date -
Feb 24, 2014
filing date -
Feb 28, 2013
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Abstract
The present invention relates to a resin composition for encapsulating an optical device and more particularly, the resin composition for encapsulating optical device of the invention comprising a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability and an organic polysilazane compound has excellent mechanical properties, and enhanced adhesive strengths to a base material and barrier properties against moisture or oxygen by having excellent solubility with siloxane resins and significantly improved outgassing phenomenon, thus being able to be applied to encapsulation process for various optical devices, especially the encapsulation process of thick films.
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