Pick and bond method and apparatus for attachment of adhesive element to substrate
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United States of America Patent
Stats
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Mar 14, 2017
Grant Date -
May 30, 2013
app pub date -
May 3, 2011
filing date -
May 3, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus for transferring formed adhesive elements from a reservoir (30) containing plural formed adhesive elements (12) to a bonding part attachable to a glass surface or other substrate through the use of adhesives. Transfer of the formed adhesive element to the bonding part (14) is accomplished by use of a vacuum tool (10) having a vacuum outlet, an internal plenum, and a series of vacuum lines formed in an adhesive element holding face. The vacuum tool is positioned over a reservoir of formed adhesive elements. Once the formed adhesive elements have been captured by the vacuum tool (10) the tool is used to place them into contact with the heated bonding part (14) directly or indirectly by intermediate placement onto a matrix (60) having a plurality of ejector pins (72) movably fitted therein. The ejector pins move the formed adhesive elements into position against the bonding part.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
A RAYMOND ET CIE | GRENOBLE |
International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- F16B:DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL E....
- B65G:TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR L....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hansel, Mathias | Rummingen, DE | 18 | 254 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 14, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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