Sensor-based removal of a soldered device
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United States of America Patent
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Mar 7, 2017
Grant Date -
Mar 24, 2016
app pub date -
Sep 18, 2014
filing date -
Sep 18, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus includes at least one grip mechanism of a rework nozzle configured to grip an electrical component that is soldered to a printed circuit board. The apparatus includes at least one spring coupled to at least one grip mechanism, where the spring is configured to move beyond a minimum threshold in response to an initiation of a melt of a solder that attaches the electrical component to the printed circuit board. The apparatus includes at least one sensor coupled to at least one spring, where the sensor is configured to detect the move of at least one spring beyond the minimum threshold. At least one sensor is configured to communicate at least one activate signal in response to detection of the move of one or more springs beyond the minimum threshold.
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