Printed wiring board and method for manufacturing printed wiring board
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United States of America Patent
Stats
-
Mar 7, 2017
Grant Date -
Jun 11, 2015
app pub date -
Dec 9, 2014
filing date -
Dec 9, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer.
First Claim
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C08J Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 7, 2028 |
