Bundled memory and manufacture method for a bundled memory with an external input/output bus
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United States of America Patent
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Mar 7, 2017
Grant Date -
Aug 13, 2015
app pub date -
Apr 27, 2015
filing date -
Mar 20, 2012
priority date (Note) -
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Abstract
A bundled memory includes a substrate, a first memory die, a second memory die, a scribe line, and an electrical connection. The first memory die has a first input/output bus, and the second memory die has a second input/output bus, where the first memory die and the second memory die are formed over the substrate. The scribe line is formed between the first memory die and the second memory die. The electrical connection is formed over the scribe line for electrically connecting to the first input/output bus and the second input/output bus, where the electrical connection is electrically connected to an external input/output bus, where a size of the external input/output bus of the bundled memory is larger than or equal to a size of the first input/output bus and a size of the second input/output bus.
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