Semiconductor IC packaging methods and structures
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United States of America Patent
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Mar 7, 2017
Grant Date -
May 8, 2014
app pub date -
Nov 7, 2013
filing date -
Nov 8, 2012
priority date (Note) -
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Abstract
An IC packaging method is provided. The method includes providing a semiconductor substrate. The semiconductor substrate has a metal pad and an insulating layer and the insulating layer has an opening to expose the meal pad. The method also includes forming an under-the-ball meal electrode on the exposed metal pad. The under-the-ball metal electrode has an electrode body and an electrode tail, the electrode body is located at a bottom portion of the under-the-ball metal electrode and is in contact with the metal pad, and the electrode tail is located at a top portion of the under-the-ball meal electrode. Further, the method includes forming a solder ball on the under-the-ball metal electrode.
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