Inspection probe and an IC socket with the same
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United States of America Patent
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Mar 7, 2017
Grant Date -
Sep 11, 2014
app pub date -
Feb 24, 2014
filing date -
Mar 1, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An inspection probe 16Ai is formed by subjecting a thin sheet material made of a copper alloy to press working. The inspection probe 16Ai includes: a device side plunger 16A having a contact point which selectively comes into contact with an electrode portion DVb of a semiconductor device DV; a board side plunger 16B having a contact point which selectively comes into contact with a contact pad of a printed wiring board 18; a spring portion 16D which biases the device side plunger 16A and the board side plunger 16B in a direction away from each other; and a cylindrical support stem 16C being disposed inside the spring portion 16D, making the spring portion 16D slidable thereon, and being configured to retain straight advancing property of the spring portion 16D.
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