Bonding apparatus and method for manufacturing bonded substrate
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United States of America Patent
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Mar 7, 2017
Issued Date -
N/A
app pub date -
Sep 21, 2015
filing date -
Mar 26, 2013
priority date (Note) -
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Abstract
A bonding apparatus includes a substrate holder holding the second substrate; a pusher pushing a back surface of the second substrate; a substrate support unit including a support talon supporting a circumferential edge portion of the first substrate to oppose the second substrate with a prescribed spacing between the second substrate and the circumferential edge portion of the first substrate; and a controller controlling a lifting/lowering operation of the pusher. The pusher pushes one prescribed point of the back surface of the second substrate, the one prescribed point corresponding to a position where a distance between a bonding surface of the first substrate and a bonding surface of the second substrate is shorter than a distance from the circumferential edge portion of the bonding surface of the first substrate to the bonding surface of the second substrate.
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