Chip-resistant film
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United States of America Patent
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Mar 7, 2017
Grant Date -
Apr 2, 2015
app pub date -
Dec 9, 2014
filing date -
Dec 16, 2005
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Abstract
A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.
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