Method of manufacturing conductive wiring and conductive wiring
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United States of America Patent
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Feb 28, 2017
Grant Date -
May 5, 2016
app pub date -
Oct 24, 2014
filing date -
Mar 28, 2014
priority date (Note) -
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Abstract
A method of manufacturing conductive wiring includes: printing on an insulated substrate 1 with ink 2 to form a predetermined pattern (S1); placing (spraying) conductive powder 3 on the ink 2 (in the predetermined pattern) before the printed ink 2 dries (S2); pressing the placed conductive powder 3 against the insulated substrate 1 to compress the conductive powder 3 (S3); and heating the compressed conductive powder 3 to sinter the conductive powder 3 (S4), and by such a series of processes (S1 to S4), conductive wiring 20 is manufactured.
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