Hybrid resonators in multilayer substrates and filters based on these resonators
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United States of America Patent
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Feb 28, 2017
Grant Date -
Mar 19, 2015
app pub date -
May 15, 2012
filing date -
May 15, 2012
priority date (Note) -
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Abstract
A filter of the present invention comprises a multilayer substrate, two terminals, a ground conductor and a hybrid resonator. The multilayer substrate includes a plurality of conductor layers and a dielectric configured to isolate said plurality of conductor layers from each other. The hybrid resonator is disposed in the multilayer substrate and comprises a first and a second resonant elements and a coupling strip connecting the first and said second resonant elements. Each resonant element comprises a signal via, a group of ground vias and an artificial dielectric. Each signal via is disposed through the multilayer substrate. Each group of ground vias is disposed through the multilayer substrate and configured to surround the signal via. Each artificial dielectric is disposed in the multilayer substrate and between the signal via and the group of ground vias. The artificial dielectric comprises a conductive plate connected to the first signal via and an isolating slit isolating the first conductive plate from the group of ground vias.

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- 10 France
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- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NEC CORPORATION | 7-1 SHIBA 5-CHOME MINATO-KU TOKYO 108-8001 |
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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Harada, Takashi | Tokyo, JP | 351 | 4614 |
Kushta, Taras | Tokyo, JP | 26 | 610 |
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