Thermal management in electronic devices with yielding substrates
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United States of America Patent
Stats
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Feb 28, 2017
Grant Date -
Jul 14, 2016
app pub date -
Mar 22, 2016
filing date -
Mar 15, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
First Claim
Other Claims data not available
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| Country | kind | publication No. | Filing Date | Type | Sub-Type |
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International Classification(s)
- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 28, 2028 |
