Thermal management in electronic devices with yielding substrates

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United States of America Patent

PATENT NO 9583691
APP PUB NO 20160204324A1
SERIAL NO

15077175

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Abstract

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In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.

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Patent Owner(s)

  • COOLEDGE LIGHTING INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tischler, Michael A Vancouver, CA 178 5255

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