LED package
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United States of America Patent
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Feb 28, 2017
Grant Date -
Feb 5, 2015
app pub date -
Jul 10, 2014
filing date -
Jul 12, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 μm to 10 μm and a depth of less than or equal to 50 μm.
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