Interconnect structure with misaligned metal lines coupled using different interconnect layer
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United States of America Patent
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Feb 28, 2017
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N/A
app pub date -
Dec 22, 2015
filing date -
Dec 26, 2014
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Abstract
In some embodiments, an interconnect structure includes a first metal line, a second metal line and a first connection structure. The first metal line is formed in a first interconnect layer, extends in length substantially along a first direction and ends at a first end portion. The second metal line is formed in the first interconnect layer, starts from a second end portion and extends in length substantially along the first direction. The second metal line is misaligned with the first metal line in the first direction. The first connection structure couples the first metal line to the second metal line. The first connection structure includes a first end-to-end portion formed in a second interconnect layer different from the first interconnect layer, and is overlapped with the first end portion and the second end portion.
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