Structure for joining ceramic plate to metal cylindrical member
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United States of America Patent
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Feb 28, 2017
Issued Date -
N/A
app pub date -
Dec 10, 2015
filing date -
Mar 27, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A member for semiconductor manufacturing device includes a susceptor which is a ceramic plate formed of AlN and a gas introduction pipe which is joined to the susceptor. An annular pipe joining bank is provided at a position of the susceptor facing a flange of the gas introduction pipe. In addition, a pipe brazed part is formed between the flange and the pipe joining bank. The flange has a width of 3 mm or more and a thickness of from 0.5 to 2 mm. It is preferable that the height of the pipe joining bank be 0.5 mm or more, the edge of the bank facing the outer edge of the flange. be chamfered as designated by C0.3 or more or rounded as designated by R0.3 or more.
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