Processes and apparatus for preparing heterostructures with reduced strain by radial compression

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United States of America Patent

PATENT NO 9583364
SERIAL NO

14142556

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Apparatus and processes for preparing heterostructures with reduced strain are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure.

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Patent OwnerAddress
GLOBALWAFERS CO LTDNO 8 INDUSTRIAL EAST ROAD 2 SCIENCE-BASED INDUSTRIAL PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Albrecht, Peter D O'Fallon, US 23 401
Falster, Robert J London, GB 88 1010
Pitney, John A O'Fallon, US 19 1083
Voronkov, Vladimir V Merano, IT 23 397

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